Beahm 520-B Split Die Ballon Bonder (MSI Update) and standard deviation) to streamline

and standard deviation) to streamline your data analysis

This system is equipped with structured product handling

5 % > 100 °C

The capacity to create a broad spectrum of tip geometries for an extensive range of catheter types and sizes

Beahm 520-B Split Die Ballon Bonder (MSI Update) and standard deviation) to streamlineThe Beahm Designs Model 520 B CE Split Die Balloon Bonder is designed for the thermal bonding and welding of thermoplastic components to a variety of materials. The system utilizes precision heated split dies and an integrated cooling chamber to protect balloons and other heat sensitive components during the bonding process. Unlike conventional systems that cycle heat on and off, the 520 B maintains both die heads at a constant process temperature for